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Semiconductor

Semiconductor

Mounting and Traceability

Mounting and traceability

Cognex vision tools provide the flexibility to handle a wide range of package types, from leaded parts to the newest SoC and MEMS devices, while DataMan® ID tools bring traceability to the back-end assembly process.

Wire Bonding

The Cognex Wire Bonder package provides tools for lead and pad location, as well as post-bond inspection.

Solder Paste Inspection

PasteInspect software checks solder paste location and shape for closed-loop control of the PCB screen printing process.

BGA Alignment

Special vision tools perform high-speed detection of missing or improper solder balls, and help rapidly align devices for placement.

SMD Placement

The SMD4® tools guide device placement onto PCBs. Users can easily import CAD data and edit part descriptions.

Package Identification

IDMax reads printed, stamped and laser-etchedbarcodes and 2D codes on PCBs and IC packages.

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