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Electronics

Electronics

Wafer and Die Alignment

PatMax technology provides robust, accurate, and fast pattern location for wafer inspection, probing, mounting, dicing, and testing equipment

Wafer and Die Alignment

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Part Location with PatMax

Accurate and repeatable part and feature location technology

Whether during the photolithographic process, wafer probe and test, or wafer mounting and dicing, poor vision alignment can cause thousands of assists and damaged wafers over the lifespan of a machine. Poorly performing vision systems cost semiconductor equipment companies market share and add significantly to their support costs.

PatMax technology provides robust, accurate, and fast wafer and die pattern location for wafer inspection, probing, mounting, dicing, and testing equipment to help avoid these problems. PatMax uses patented geometric pattern-finding algorithms to locate and align variable wafer and die patterns. It aligns wafers and dies with high accuracy and high repeatability, ensuring reliable equipment performance throughout the semiconductor manufacturing process. With Cognex, OEMs can optimize their equipment’s overall performance, improving quality and yield.

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