Machine vision inspects wafers and dice for defects
Machine vision is used throughout the semiconductor manufacturing process, from monitoring the diameter of ingots as they are being formed to inspecting a die lead frame prior to wire bonding. Though machine vision-enabled inspection is critical during all stages, specific back-end inspections at the die- and package-level help OEMs maintain strict quality standards.
PatMax technology locates and inspects surface defects like probe marks and IC marks; inspects bond pads, wires, and BGAs; locates cracks and chips that affect die quality; and helps provide real-time feedback to dicing machines. PatMax provides detailed defect data for inspection, independent of a die or package’s orientation, size, and shading variations. The use of machine vision for these inspections helps OEMs limit semiconductor defects and dramatically improve equipment yield.