MicroLED Panel Inspection
Detect variable defects of microLEDs on display panels
MicroLEDs are directly bonded to a panel from a wafer and inspected for defects, such as scratches, contaminants, or broken die. Due to their extremely small size (<100 microns) and thinness, microLED die are subject to catastrophic production defects that might otherwise be acceptable for larger LEDs or mini LEDs. MicroLED display screens for TVs, smartphones, or VR gear require 100% inspection and ultra-low counts of bad LEDs, as too many defects can affect the luminance and color uniformity of the display. There can be millions of microLEDs within a TV light panel, so inspections must be fast and accurate to maintain fast production speeds. Defects can be highly variable, making it too complex for traditional rule-based machine vision.
Cognex AI-based technology helps microLED manufacturers identify defective die on display panels. The system is trained using a series of images that represent both good and No Good (NG) results, enabling the software to omit variations that are within tolerance and only flag significant defects. Working in zones across the panel, the analyze tool finds subtle defects in the microLEDs. Using the classification tool, production managers can categorize the various defects and use that data to optimize upstream processes and increase overall production efficiency. Identifying and fixing defects early in the process is cost-effective and helps manufacturers deliver high-quality panels to their customers.