Wafer Processing, Inspection, and Identification
Machine vision performs alignment, inspection, and identification to help manufacture high quality wafers used in integrated circuits (ICs) and other semiconductor devices. Machine vision automates wafer handling, enables precision alignment, inspects bond pads and probe tips, and can measure critical dimensions of crystalline structures.
Die Quality: Dicing Guidance, Inspection, Sorting,
After wafer processing is complete, dies are separated from their wafers and are sorted into categories based on various qualities. Vision systems guide the dicing saw, and vision tools locate cracks and chips that affect die quality. Inspections verify resistor markings and assess LED color quality and brightness. Dies that
have been successfully sorted are then bonded to their packages.
Download: Semiconductor and Electronics Industry Guide
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Semiconductor Fabrication: Mounting and Packaging
Wafer mounting is part of the semiconductor fabrication process, during which wafers are prepared for packaging. Cognex tools handle a wide range of package types, from leaded parts to the newest SoC and MEMS devices. The Cognex Wire Bonder package provides tools for lead and pad location, as well as post-bond inspection.
Industrial image-based barcode readers handle even degraded, reflective, or low-contrast marks from die backsides, substrates, encapsulated packages, and PCBs for complete traceability. In-Sight® 1740 series wafer readers reliably track parts from processing through assembly by reading codes on PCBs and IC packages, maximizing tool utilization and production yield.
Cognex machine vision products monitor ingot formation, providing precise dimensional measurements during the crystal pulling process. The In-Sight 8000’s small form factor and robust edge detection tool ensure the crystal seeding, shouldering, shoulder circuiting, and diameter equalizing stages are performed to exacting standards for proper ingot formation.