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  • Wafer Inspection with Cognex Vision

    Confidence for the Entire Semiconductor Process

     

    It starts with wafer challenges …

    Wafer pre-alignment
    Wafer identification
    Wafer fine alignment
    Wafer inspection
    Bond pad inspection
    Probe tip inspection 

     

    ... continues with die quality ...

    Dicing saw guidance
    Kerf inspection
    Die bonding 

     

    ... and ends with mounting and traceability.

    Wire bonding
    Solder paste inspection
    BGA alignment
    BGA inspection
    SMD placement
    Package inspection
    Package identification