Wafer Inspection with Cognex Vision
Confidence for the Entire Semiconductor Process
It starts with wafer challenges …
Wafer pre-alignment
Wafer identification
Wafer fine alignment
Wafer inspection
Bond pad inspection
Probe tip inspection
... continues with die quality ...
Dicing saw guidance
Kerf inspection
Die bonding
... and ends with mounting and traceability.
Wire bonding
Solder paste inspection
BGA alignment
BGA inspection
SMD placement
Package inspection
Package identification